Glass embedding with self-levelling polyurethane
SikaGlaze GG-735 and Sika Icosit KC-340/7 are self-levelling two-part polyurethane products suitable for embedding glass panes into a support frame (e.g. anodized aluminium, polyester
SikaGlaze GG-735 and Sika Icosit KC-340/7 are self-levelling two-part polyurethane products suitable for embedding glass panes into a support frame (e.g. anodized aluminium, polyester
Accordingly, embodiments disclosed herein provide architectures with MIA components embedded within a glass core and process flows designed to enable such architectures.
This document contains recommendations and hints for the application of SikaForce®-335 GG, a self-levelling polymer grout based on polyurethane resin, for the embedding of monolithic or
This paper presents a technology demonstration of two novel 3D glass-based architectures for high performance computing applications. Current 3D technologies ar.
Abstract—This paper presents a die-embedded glass interposer process using a new double-sided release method. This new method is introduced for CTE balancing and minimum
Two such architectures are designed and demonstrated in this paper. The first test vehicle shows multiple dies embedded and interconnected in a glass cavity, along with dies assembled on
This article presents a multiple-die-embedded glass package that supports a thermal management solution for millimeter-wave (mmWave) applications. The package
This article describes the fabrication process for 3D GPE, leading to demonstration of a technology using embedding of chips with all-Cu interconnections at 40-μm I/O pitch with
Glass offers high dimensional stability, good CTE match to silicon chip, low electrical loss, and high precision wiring for embedding RF passives.
With SikaForce®-335 GG (former SikaGlaze® GG-735) the bottom glass edge is embedded in standard U-profiles, and loads are securely transferred through the glass elements thus results
This paper presents a technology demonstration of two novel 3D glass-based architectures for high performance computing applications. Current 3D technologies ar.
Two such architectures are designed and demonstrated in this paper. The first test vehicle shows multiple dies embedded and interconnected in a glass cavity, along with dies assembled on
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